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2016.07.28 Financial Results for the First Quarter FY2016
2016.06.01 Annual Financial Results for the Year Ended March 31,2016
2016.01.28 Financial Results for the Third Quarter FY2015
2015.10.29 Financial Results for the Second Quarter FY2015
2015.09.01 Notice Concerning Separation of Tera Probe's Wafer Level Packages(WLP) Business and Transfer of WLP Shares
2015.07.30 Financial Results for the First Quarter FY2015
2015.05.15 Summary of Consolidated Financial Statements of Fiscal 2014(April 1, 2014 - March 31, 2015)
2015.04.30 Notice Concerning Approval of a Comprehensive Agreement
2015.01.29 Summary of Consolidated Financial Statements for the Third Quarter of Fiscal 2014(April 1, 2014 - December 31, 2014)
2014.10.28 Summary of Consolidated Financial Statements for the Second Quarter of Fiscal 2014(April 1, 2014 - September 30, 2014)
2014.07.29 Summary of Consolidated Financial Statements for the First Quarter of Fiscal 2014(April 1, 2014 - June 30, 2014)
2014.05.09 Summary of Consolidated Financial Statements of Fiscal 2013(April 1, 2013 - March 31, 2014)
2014.03.04 Invitation to SEMICON China 2014 Exhibit
2014.01.30 Summary of Consolidated Financial Statements for the Third Quarter of Fiscal 2013(April 1, 2013 - December 31, 2013)
2013.11.28 Tera Probe Acquires Wafer Bump Facilities from Fujitsu Semiconductor and Starts Accepting Orders
2013.11.26 Ishii Hyoki and Tera Probe Develop World First Inkjet Coater for WLP and Bumping
2013.11.08 Tera Probe will exhibit “SEMICON Japan 2013”

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