• Presenting total solutions For semiconductor testing and assembly With reliable technology and our unique expertise
  • Development of testing technology
  • Wafer testing
  • Assembly, WLP
  • Final testing

Infomation

2016.01.28 Summary of Consolidated Financial Statements for the Third Quarter FY2015(April 1, 2015 - December 31, 2015)
2015.10.29 Summary of Consolidated Financial Results for the Second Quarter FY2015(April 1, 2015 - September 30, 2015)
2015.09.01 Notice Concerning Separation of Tera Probe's Wafer Level Packages(WLP) Business and Transfer of WLP Shares
2015.07.30 Summary of Consolidated Financial Results for the First Quarter of FY2015(April 1, 2015 - June 30, 2015)
2015.05.15 Summary of Consolidated Financial Statements of Fiscal 2014(April 1, 2014 - March 31, 2015)
2015.04.30 Notice Concerning Approval of a Comprehensive Agreement
2015.01.29 Summary of Consolidated Financial Statements for the Third Quarter of Fiscal 2014(April 1, 2014 - December 31, 2014)
2014.10.28 Summary of Consolidated Financial Statements for the Second Quarter of Fiscal 2014(April 1, 2014 - September 30, 2014)
2014.07.29 Summary of Consolidated Financial Statements for the First Quarter of Fiscal 2014(April 1, 2014 - June 30, 2014)
2014.05.09 Summary of Consolidated Financial Statements of Fiscal 2013(April 1, 2013 - March 31, 2014)
2014.03.04 Invitation to SEMICON China 2014 Exhibit
2014.01.30 Summary of Consolidated Financial Statements for the Third Quarter of Fiscal 2013(April 1, 2013 - December 31, 2013)
2013.11.28 Tera Probe Acquires Wafer Bump Facilities from Fujitsu Semiconductor and Starts Accepting Orders
2013.11.26 Ishii Hyoki and Tera Probe Develop World First Inkjet Coater for WLP and Bumping
2013.11.08 Tera Probe will exhibit “SEMICON Japan 2013”

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