Timely disclosure Sep. 1, 2015 Notice Concerning Separation of Tera Probe's Wafer Level Packages(WLP) Business and Transfer of WLP Shares
Financial result May. 15, 2015 Summary of Consolidated Financial Statements of Fiscal 2014(April 1, 2014 - March 31, 2015)
Financial result Jan. 29, 2015 Summary of Consolidated Financial Statements for the Third Quarter of Fiscal 2014(April 1, 2014 - December 31, 2014)
Financial result Jul. 29, 2014 Summary of Consolidated Financial Statements for the First Quarter of Fiscal 2014(April 1, 2014 - June 30, 2014)
Financial result May. 9, 2014 Summary of Consolidated Financial Statements of Fiscal 2013(April 1, 2013 - March 31, 2014)
Financial result Jan. 30, 2014 Summary of Consolidated Financial Statements for the Third Quarter of Fiscal 2013(April 1, 2013 - December 31, 2013)
Notice Nov. 28, 2013 Tera Probe Acquires Wafer Bump Facilities from Fujitsu Semiconductor and Starts Accepting Orders
Notice Nov. 26, 2013 Ishii Hyoki and Tera Probe Develop World First Inkjet Coater for WLP and Bumping