Test Operation
Service

We provide wafer test and final test services for a wide variety of semiconductor products which demand has been increasing.
We provide our customers with security and reliability setting up the optimal test environment, such as one of the best dedicated clean room in Japan, and with have an improved efficiency of mass production with support of the skilled engineers.

Our Services

  • Operation

    24 hours a day, We utilize testers*1 and probers*2 to electrically test to verify whether or not the semiconductor products meet customer’s specifications.
    We will provide a wide range of support such as suitable allocation for customers, improvement of testing efficiency, and root cause analysis.

    Our main testing

    Verification of function with electric signals; stress test with high temperature/bias to remove early failed products before shipment; and, Visual inspection

  • Our technology supporting operations

    Repair and inspection of equipment such as testers*1, probers*2, and probe cards*3 used for testing require know-how: e.g. maintenance of probe card needs advanced skill to fix a needle with a size of one-hundreds of 1mmwith tweezers to return it to the right place. Also, testing with high temperature/bias requires technical qualifications and expertise.

  • *1 Tester:

    An equipment for testing electrical properties of semiconductors

  • *2 Prober:

    An equipment to which a probe card is attached used in connection with a tester

  • *3Probe card:

    A connecting jig (probe) used for electrical test of semiconductor chips for in wafer testing. It connects a pad (electrodes) of a semiconductor chip and a tester. A semiconductor chip is electrically tested and verified for pass/fail judgments by connecting probe to pad. Since a probe layout changes depending on a pad position of a semiconductor chip, a dedicated probe card is required for each product.

The technologies supporting operations and
a lot of accumulated data lead
to our various solutionsfor testing.

Tester Lineup

  • Logic (CPU, SoC)

    • Services from wafer test to final test
    • Support for products from small pins to multi-pin products
  • Image sensor (CIS, CCD)

    • Compatible with high-speed CIS/CCD
    • Alliance member of MIPI
    • Test environment with dedicated clean room
    • Experienced engineering support
  • Analog /Mixed Signal

    • Reduction of test costs with the latest test equipment
    • A wide range of test environments (from LSI linear ICs and power supply control ICs to RFLSIs)
  • Memory (DRAM, Flash)

    • Technical capability based on a lot of experience in memory test
    • On-site probe card maintenance support

We provide testing for a wide variety of semiconductor products with our tester lineup.

Click here for our tester lineup Click here for further inquiries
Classification. Manufacturer Type name
Tester SoC,MUC ADVANTEST T3347A
T6563
T6575
T6577
T6573
T6672
T6673
T2000LS
T2000EPP
V93000(PS1600)
Teradyne J750EX
Megnum2 SV
Memory ADVANTEST T5335P
T5371
T5377
T5377S
T5383
T5722
T5588
T5593
T5830
T5833
Analog/Mixed Signal ADVANTEST T2000IPS
T7721
EVA100
Teradyne μFlex
ETS-800
ADVANTEST V93000RF
Shibasoku WL25
WL25V
Sensor Teradyne IP70EP
IP70EMP
IP750EX
ADVANTEST IP750EX-HD
T2000ISS
Trimmer ESI Group model 9830
model 9850TP
M550
         

BUSINESS