Career

Application Guidelines

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Positions Semiconductor Equipment, Jig & Tool Engineer
Number of positions 5
Job Description ・Ensuring test quality that conforms to quality of product design, and improving test efficiency
・Improvement, evaluation, introduction, development and rationalization of elemental technologies and equipment
・Ensuring/improving quality and technology for contact of tools and jigs
・Probing process, operation construction, and improvement activities 
・Introduction and verification of new testing technologies, acceleration of efficiency, and work related to design of testing process
Requirements ・Experience and knowledge of semiconductor production and test related work.
・Japanese language skills: understanding of Japanese used in everyday situations and some understanding of Japanese used in a wider range of situations.(Japanese Language Proficiency Test:N2 or more)
■Preferred qualifications
・Experience and knowledge as an equipment and tooling engineer.
・Experience in management or playing manager.
・English communication skills (beginner)
Employment Type Full-time
Educational background Not required
Location Kyushu Operation Center (Ashikita-machi, Ashikita-gun, Kumamoto)
Working hours 8:30 - 17:15 (flex time system adopted, core time 8:30 - 11:45)
Salary and allowance Monthly base salary: 200,000 yen to 429,000 yen (determined by our rules based on your experience and other factors)
Various allowances: Overtime allowance, Role pay, Family allowance, Commuting allowance, and Meal allowance (in accordance with our rules)
Benefits Various insurance (health, welfare, employment, and workers' compensation)
Savings support program, Defined contribution pension plan, Retirement allowance, Cafeteria plan, Language Learning support, Cafeteria
Salary increase Once a year
Bonus Twice a year (June and December)
Leave/Vacation 2 days off per week (Saturdays & Sundays), National holidays, Special holidays, Year-end and New Year holidays
Annual paid leave (20 days ※proportionally grated according to date of hire)
Celebration or condolence leave, Refreshment leave, Family friendly leave, etc.
Application Process Document screening, interview
Positions Semiconductor equipment, jig and tool maintenance engineer (shift work)
Number of positions 5
Job Description ・Preventive and corrective maintenance for all equipment, jigs and tools for the wafer test or final test
・Improvement of MTTR/MTBF, management of spare parts and measuring equipment
・Reporting to customers in case of abnormality
Requirements ・Interested in semiconductors
・Japanese language skills: Able to understand basic Japanese(Japanese Language Proficiency Test:N4or more)
■Preferred qualifications
・Work Experience in production and testing for semiconductor products
・English communication skills (Beginner)
Employment Type Full-time
Educational background Not required
Location Kyushu Operation Center (Ashikita-machi, Ashikita-gun, Kumamoto)
Working hours Shift work with 4 days work and 4 days off
(1) Day shift: 8:30 to 20:45 (2) Night shift: 20:30 to 8:45
Salary and allowance Monthly base salary: 180,000 yen to 300,000 yen (determined by our rules based on your experience and other factors)
Shift work allowance: 19,100 yen
Various allowances: Overtime allowance, Role pay, Family allowance, Commuting allowance, and Meal allowance (in accordance with our rules)
Benefits Various insurance (health, welfare, employment, and workers' compensation)
Savings support program, Defined contribution pension plan, Retirement allowance, Cafeteria plan, Language Learning support, Cafeteria
Salary increase Once a year
Bonus Twice a year (June and December)
Leave/Vacation Subject to the Company's calendar (4 work days and 4 days off, 182 days off per year, basically)
Annual paid leave (20 days ※proportionally grated according to date of hire)
Celebration or condolence leave, Refreshment leave, Family friendly leave, etc.
Application Process Document screening, interview

Application Process

Please note that the application process is subject to change.

First step


Documents Screening

Second step


Interview by Division manager

※With written exam depending on the position

Final step


Executive interview